DIGIPAS TECHNOLOGIES INC. is a California based company specializes in research, design and global distribution of Digi-Pas® intelligent 2-axis inclinometers, scientific levelling instruments, high-precision angular measuring and industrial-grade tilt-sensing devices. We are a world-leading manufacturer of digital levelling instruments/tools, 2-axis precision electronic tilt-angle sensor modules and surface flatness measuring instruments as well as 2D alignment-diagnostic straightness instruments specifically engineered for research scientists, industrial professionals, specialists, tradesmen & DIY users.
Digipas Technologies Inc. is affiliated with Digipas Group having a history of over 20 years with offices located in US, Japan, UK, Germany and Singapore. As a maturing group of companies, we are organized into three main business units covering a broad customer base in various industries at a global scale to ensure stable growth yet mitigating the effects of sectoral market cyclical changes. Digipas group is led by Dr Jim Li who attained a PhD from Cambridge University, UK and holds over 40 patents in the field of advanced technology deployment to electronic devices and manufacturing processes. His team comprises highly specialized professionals focusing on the development of core capabilities within the niched domain expertise of advanced MEMS-driven precision digital levelling, 2D angular measurement and IoT-enabled proximity/remote authorized access security (smart locking devices) technologies.
With over two decades of research, development and manufacturing expertise, our products, services and technologies are utilized in high-precision machining, metrology and consumer industries all over the world.
Digipas division specializes in the research, development, manufacture and distribution of HIGH PERFORMANCE, QUALITY yet AFFORDABLE digital levels and DUAL-AXIS smart inclinometers to replace the use of traditional spirit 'bubble' levels and conventional single-axis inclinometers. These proven industrial and scientific-grade instruments are built with advanced 2-Axis & 3-Axis Thermocompensated Super-MEMS Technology, and precisely compensated for nonlinearity and temperature variation to effectively withstand stringent operating environments. The superiority of high-precision 2-axis MEMS Sensor compounded with digital embedded technologies offer 2-dimentional (planar) tilt-angle and leveling measurements with graphic-animated Smart 2D Bubble® bull's eye, wireless and remote real-time logging unique capabilities. Essentially, these radically differentiated features transform into PRECISE, ACCURATE, FAST & RELIABLE leveling, wide-range angle measurement/tracking /monitoring (0° ~ 360°) at resolutions of 0.1°, 0.05°, 0.01°, 0.001°, & 0.0002° (5µm/M or 1 arcsec) as well as having small footprint and high shock/impact resistant (3,000g to 6,000g). These radically unique functions with no mechanical moving parts of its sensor offer unparalleled performance and benefits to field engineers, application designers and scientists unmatched by any traditional spirit 'bubble' levels or conventional single-axis pendulum/servo-based inclinometers.
Another business division focuses on the development and distribution of eGeeTouch® IoT-enabled smart locking devices that replace conventional keyed and combination-digits-dial locks. It utilizes state-of-art proximity-access and remote-authorized security technologies, world's first of its kind, granted with over a dozen patents in this field of invention and received numerous innovation awards in world-leading tradeshows.
The third business devision specializes on flexible flat cable (FFC) and interconnects. This business unit was formerly acquired from SONY Chemical & Information Device, Japan in 2008. Since, we have instantly positioned in the forefront as one of the global leading FFC manufacturer.
For over a decade, our innovation strategy is based on the concept of Transformative Innovation through which emerging technologies are relentlessly identified, developed and deployed with existing established technologies to create radically distinctive new products with unparalleled performances greatly benefiting our clients. These new intelligent products replace their traditional counterparts/products while simultaneously creating new catergories of applications in various industries unavailable previously (such as Driverless car, AI-enabled medical equipment etc.).
As leveling and angular measurements are vital functions for precision equipment development, installation, machine alignments and metrology in many industries within the precision engineering cluster. Imprecise leveling or alignment of a machine by using out-dated measuring tools affects its structural stability thus severely reduces dimentional accuracy, functional and quality performances of the machine including reduction in yield of its output machined parts/objects.
In 2009, Digipas pioneered the world's-first Digi-Pas® Dual-Axis MEMS-driven intelligent precision digital levels to replace the conventional 'bubble' levels, and it was in 2010 first introduced at IMTS, Chicago. In 2011, we further pioneered the world's-first Digi-Pas® dual-axis digital machinist level that had greatly simplified any high precision levelling and planar angle measurement tasks. In 2012, we sustained our innovation by presenting the world-first Digi-Pas® 2-axis ultra-precision inclinometer at JIMTOF, Tokyo. These intelligent-diagnostic instruments and technologies have been evidently used by some of the world’s most technologically advanced companies, research laboratories and government institutions such as NASA, Lockheed Martin, US Navy, US Air Force, Raytheon, IHI Corporation (Japan), Boeing, Airbus, Space X, Intel, Hurco, Makino, DMG Mori, Mazak, Honda, Toyota, Mitsubishi, BMW, Audi, Hyundai, US Naval Research Laboratory, Cambridge's Cavendish Laboratory, Sandia National Laboratories etc. For over a decade, we consistently gain high credibility to successfully innovate and scale-up our new products in volume and variety of generic models to meet the needs of our worldwide clients.
In 2014, we further pioneered the world-1st IoT-enabled smart locking devices which found many applications in security and consumer industries. These devices utilize advance encrypted wireless proximity-access and remote authorization security technologies, and subsequently the smart locks have been adopted and sold in major global markets such as U.S., Japan, U.K, E.U. and Asia.
In 2014, our eGeeTouch® business division lauched the award-winning IoT-enabled Smart Locks, for applications such as on luggage and padlocks which provide hassle free and enhanced security in safeguarding personal belongings for the increasingly mobile worldwide travelers. These smartlocks, serve an enduring needs for securing physical assets, strategically seek to displace those old-fashioned key/dials-locks. Upon launching in Tokyo, eGeeTouch® NFC-driven smart padlock won the New Product Award at Japan's largest DIY Homecenter Tradeshow for 2014 & also 2015. The radically-distinct eGeeTouch® NFC smart luggage lock contested among world's best innovation further won the highly prestigious Innovation Award at the world's largest US Consumer Electronics Show (CES) 2015 and also consecutively in CES 2016. These world-first innovative products were featured by leading international media such as CNN, USA Today, Fox News, CBC News, Nikkei, CNet, Engaget, Mashable, UK's Daily Mail and many others.
Patents, Trademarks and proprietary technologies of our intellectual properties are obvious manifestation of our R&D team novel ideas and capabilities resulting from relentless and sustained research and development activities over a decade. Our IP portfolio contents over 40 granted patents and trademarks by USPTO, WIPO, JPO, CNIPA covering jurisdictions including US, Europe, Japan, China, India, Singapore and numerous countries in both advanced and emerging economies. This comprehensive IP portfolio serves as a solid foundation to provide distributorships and licensing to our worldwide business partners. In addition to patents, trademarks and proprietary technologies in specialized domains, we obtain world's leading Calibration Certifications by accredited U.S., Japan and Germany calibration bodies with NIST, JIS and DIN standards to form our intagible assests which significantly raising entry barriers and risks to new enterance within these market segments.
The unique products under the brands of Digi-Pas®, eGeeTouch® and Ventura V-Flex® are patented, and certified by UL, TÜV SÜD, SGS to comply with CE, FCC, UL, C-Tick, RoHS. Our measurement product's ACCURACY performance to specification has been externally verified by accredited third party calibration & test bodies in USA, Japan, UK and Germany in accordance to ISO/IEC 17025:2005 standard, providing Calibration Certificates traceable to NIST, JIS, UKAS & DIN standards under the American Association for Laboratory Accreditation (A2LA) and International Laboratory Accreditation Cooperation (ILAC). Digi-Pas ultra-high precision instruments and sensor modules are specifically designed to comply with EAR99 classification, while certain product models may require export license under U.S. Commerce Control List (CCL).
Our factories are ISO9001, ISO14001 & TS16949 certified and periodically audited by world's leading SGS certification body for traceability, environmental conformance, and work safety & health management. These factories produce flexible flat cables, digital levelling & angular measuring instruments and also smart locking devices.
2005 to 2008
2000 to 2004
Expanded into Precision Plastic Injection Moulding to manufacture component for Floppy Disk Drive, CD and DVD - magnetic & Optical Computer Data Storage Drives.
Established our first manufactruing site/factory.
Established the first company in Singapore