Company Overview

DIGIPAS TECHNOLOGIES INC. is a California based company specializes in research, development, design and global distribution of world-leading Digi-Pas® intelligent inclinometers, scientific levelling and advanced angular measuring instruments providing a full range of digital levelling tools, 2-axis precision electronic tilt angles and surface flatness measuring instruments as well as 2D alignment-diagnostic instruments specifically developed for professionals, specialists, tradesmen & DIY users.

Another business division of Digipas focuses on the development and distribution of eGeeTouch® IoT-enabled smart locking devices ( ) that replace conventional combination-dial/key locks. It utilizes state-of-art proximity & remote authorized access-gaining security technologies, world's first of its kind and received numerous innovation awards in world-leading tradeshows. Digipas USA LLC is a Connecticut based company that distributes Digi-Pas® brand digital levels and precision angular measuring instruments.

Digipas Technologies Inc. is affiliated with Digipas Group having a history of over 20 years with offices located in US, Japan, UK, Germany and Singapore. As a maturing group of companies for over two decades, we are organized into three main business units covering a broad customer base in various industries at a global scale to ensure stable growth yet mitigating the effects of sectoral market cyclical changes. This group is led by Dr Jim Li who attained a PhD from Cambridge University, UK and holds over 30 worldwide patents in the field of advanced technology deployment to electronic devices and manufacturing processes. His team comprises highly specialized professionals focusing on the development of core capabilities within the niched domain expertise of advanced MEMS-driven precision digital levelling, 2D angular measurement and intelligent proximity and remote access-gaining security technologies.


Digipas division specializes in the   research, development, manufacture and distribution of HIGH PERFORMANCEQUALITY yet AFFORDABLE digital levels and smart inclinometers to replace the use of traditional spirit 'bubble' levels and conventional single-axis inclinometers. These proven industrial and scientific-grade instruments are built with advanced 2-Axis & 3-Axis Thermocompensated Super-MEMS Technology, and precisely compensated for nonlinearity and temperature variation to effectively withstand stringent operating environments. The superiority of high-precision 2-axis MEMS Sensor compounded with digital embedded technologies offer 2-dimentional (planar) tilt-angle and leveling measurements with graphic-animated Smart 2D Bubble®  bull's eye, wireless and remote real-time logging unique capabilities. Essentially, these radically differentiated features transform into PRECISE, ACCURATE, FAST & RELIABLE leveling, wide-range angle measurement/tracking /monitoring (0° ~ 360°) at resolutions of 0.1°, 0.05°, 0.01°, 0.001°, & 0.0002° (5µm/M or 1 arcsec) as well as having small footprint and high shock/impact resistant (3,000g to 6,000g). These radically unique functions  with no mechanical moving parts of its sensor offer unparalleled performance and benefits to field engineers, application designers and scientists unmatched by any traditional spirit 'bubble' levels or conventional single-axis pendulum/servo-based inclinometers.


For over a decade, our innovation strategy is based on the concept of Transformative Innovation through which emerging technologies are relentlessly identified, developed and deployed to create radically distinctive new products with unparalleled performances greatly benefiting users.

As leveling and angular measurements are vital functions for precision equipment installation, machine alignments and metrology in many industries within the precision engineering cluster, imprecise leveling a machine by using out-dated measuring tools affects its structural stability thus severely reduces the accuracy, functional and quality performances of the machine including its output machined parts/objects. In 2009, Digipas group pioneered the world's-first Digi-Pas® Dual-Axis MEMS-driven intelligent precision digital levels to replace the conventional 'bubble' levels, and it was in 2010 first introduced at IMTS, Chicago. In 2011, we further pioneered the world's-first Digi-Pas® dual-axis digital machinist level that had greatly simplified any high precision levelling and planar angle measurement tasks. In 2012, we sustained our innovation by presenting the world-first Digi-Pas® 2-axis ultra-precision inclinometer at JIMTOF, Tokyo. These intelligent-diagnostic instruments and technologies have been evidently used by some of the world’s most technologically advanced companies, research laboratories and government institutions such as NASA, Lockheed Martin, US Navy, US Air Force, Raytheon, IHI Corporation (Japan),  Boeing, EADS (Airbus), Space X, Intel, Makino, Honda, Toyota, Mitsubishi, MAZAK, BMW, Audi, Hyundai, US Naval Research Laboratory, Cambridge's Cavendish Laboratory, Sandia National Laboratories etc. For over a decade, we consistently gain high credibility to successfully innovate and scale-up our new products in volume and variety of models to meet the needs of our worldwide customers.

In 2014, we further pioneered the world-1st IoT-enabled smart locking devices which found many applications in security and consumer industries. These devices utilize advance encrypted wireless proximity-access and remote authorization security technologies, and subsequently the smart locks have been adopted and sold in major global markets such as U.S., Japan, U.K, E.U. and Asia.


In 2014, our eGeeTouch® business division lauched the award-winning IoT-enabled Smart Locks, for applications such as on luggage and padlocks which provide hassle free and enhanced security in safeguarding personal belongings for the increasingly mobile worldwide travelers. These smartlocks, serve an enduring needs for securing physical assets, strategically seek to displace those old-fashioned dial/key-locks. Upon launching in Tokyo, eGeeTouch® NFC-driven smart padlock won the New Product Award at Japan's largest DIY Homecenter Tradeshow for 2014 & also 2015. The radically-distinct eGeeTouch® NFC smart luggage lock contested among world's best innovation further won the highly prestigious Innovation Award at the world's largest US Consumer Electronics Show (CES) 2015 and also consecutively in CES 2016. These world-first innovative products were featured by leading international media such as CNN, USA Today, Fox News, CBC News, Nikkei, CNet, Engaget, Mashable, UK's Daily Mail and many others.


Patents and various forms of intellectual properties are obvious manifestation of our R&D team novel ideas and capabilities resulting from relentless and sustained research activities over a decade. Our IP portfolio contents over thirty granted patents and trademarks at USPTO and WIPO covering jurisdictions including US, Europe, Japan, China, India, Singapore and numerous countries in both advanced and emerging economies. This comprehensive IP portfolio serves as a solid foundation to provide distributorships and licensing to our worldwide business partners.


The unique products under the brands of Digi-Pas® and eGeeTouch® are patented, and certified by TÜV SÜD, SGS to comply with CE, FCC, C-Tick, RoHS. Our measurement product's ACCURACY performance to specification has been externally verified by accredited third party calibration & test bodies in USA, Japan, UK and Germany in accordance to ISO/IEC 17025:2005 standard, providing Calibration Certificates traceable to NIST, JIS, UKAS & DIN under the American Association for Laboratory Accreditation (A2LA) and International Laboratory Accreditation Cooperation (ILAC).


Our factories are ISO9001, ISO14001 & TS16949 certified and periodically audited by world's leading SGS certification body for traceability, environmental conformance, and work safety & health management. These factories produce flexible flat cables, digital levelling & angular measuring instruments and also smart luggage locks & intelligent access security systems.

With over two decades of research, development and manufacturing expertise, our products, services and technologies are utilized by millions of consumers all over the world.



  • Granted USPTO utility patent, US Pat. No.: 9,459,121 B2 entitled "Angle Measuring Device and Methods for Calibration".
  • Granted USPTO utility patent, US Pat. No.: 9,524,600 B2, entitled "Luggage Locking Device and Baggage Handling Method".


  • Again, DIGIPAS introduced eGeeTouch® NFC-Bluetooth (DUAL-TECH) Smart Travel Padlock at Japan's largest DIY Homecenter Show 2015 (Tokyo) and it won the New Product Award based on Buyers' votes outperforming hundreds of contestants from all over the world.
  • Similarly, DIGIPAS further launched another world's pioneering eGeeTouch® NFC-Fingerprint Smart Luggage Lock at 2016 CES at Las Vegas, USA. This Smart Luggage Lock won another CES Innovation Award under Tech for a Better World category.


  • DIGIPAS introduced the world's first eGeeTouch® NFC-driven Smart Electronic Padlock at Japan's largest DIY Homecenter Show 2014 (Tokyo). The Smart Padlock won New Product Award based on Buyers' votes outperforming hundreds of contestants from Asia, U.S. & Europe.
  • DIGIPAS launched the world's pioneering eGeeTouch® NFC-driven Smart Luggage Lock at 2015 CES International (Las Vegas) U.S.A. The Smart Luggage Lock won CES Innovation Award, under Tech for a Better World category. CES is the world's largest Consumer Electronic Show organized by U.S. Consumer Electronic Association, representing over $203 billion U.S. consumer electronics industry.


  • Digi-Pas® introduced at the National Hardware Show (Las Vegas) U.S., the world's-first IP67 rating Waterproof Torpedo Digital Level embedded with LED technology, capable of wide operating temperature range -20°C to +60°C.
  • Granted USPTO utility patent - Electronic Combination Lock, USPTO Patent No. US 9,121,199 B2
  • Filed and published USPTO patent pending - Angle measuring device and method for calibration, US Pat. App. No.: US 2014/0350881 A1.


  • Digi-Pas® launched at JIMTOF Exhibition (Tokyo) Japan, the world's-first 2-axis Ultra-Precision Digital Level with an accuracy of 1 arcsec or 5µm/M, embedded with vibrometer, Bluetooth and 3D Surface Geometry Profiling software features.
  • Granted USPTO Design Patent - Dual Axis Digital Level, U.S. Patent No. US D692,328 S
  • Filed patent in Germany: Patent No. DE 11 2010 005 595 T5 - EU
  • We continue to acquire FFC manufacturing machinery from Hitachi Cable Malaysia and Hitachi Cable Singapore, to consolidate the FFC industry in the region and we have since become the largest Flexible Flat Cable manufacturer in ASEAN.


  • A breakthrough-world-1st industrial-grade 2-Axis Machinist Digital Level, DWL3500XY, of 0.001° or 18µm/M or 3.6 arcsec resolution and accuracy for the precision engineering industry was exhibited in Germany and Australia.
  • Digi-Pas® precision digital levels were awarded Calibration Certificates by various accredited calibration & test laboratories in USA, Japan, UK, Germany and the National Metrology Centre for conformance to NIST, JIS, UKAS & DIN standards.
  • Awarded CANON Green Procurement Certificate.


  • Released the world-1st industrial-grade Dual-Axis High Precision Digital Level incorporated with Vibrometer based on Advanced MEMS Technology. Model DWL3000XY was exhibited in Tokyo, Japan and in IMTS, Chicago, USA.
  • PCT Patent filed for a Green & Cost Effective Rigid-Flex PCB and a miniature Electronic Lock
  • Introduced the Ventura V-Flex® Whisker Controlled FFC


  • The world-1st Digital Post Level, DWL1000XY, was exhibited in London Hardware Show.
  • Acquired the Flexible Flat Cable (FFC) business unit from SONY Chemical and Information Device, Japan and had since become one of the world largest FFC electronic component manufacturers.
  • Ventura V-Flex ® trademark was registered IPOS.
  • JSB Tech Japan Sales Office was established in Tokyo.

2005 to 2008

  • Establish Joint Venture Company, Meisei-Ventura Thailand Co. Ltd at Ayutthaya. Specializing in FPC Part and component assembly. It was joint venture with Japanese Meisei Group. (the JV was sold to Meisei Group in 2011)
  • Developing specialised manufacturing process capability.
  • 2 (two) PCT Patents were filed for FPC Manufacturing Processes and Digital Angular Measurement Instruments
  • Attained CE, FCC and C-Tick from TUV & PSB for Digital measurement products
  • Expanded total manufacturing capacity in the region to over 100,000 sq. ft. and over 1,000 manpower
  • Obtained OHSAS 18001 certification for Health & Safety management of our affiliated factories.
  • Expanded Optical Disk Drive for laptop PC manufacturing capacity to 5 million units per year.

2000 to 2004

  • Obtained ISO 9002 Certification
  • Embarked on full Box-Built Assembly product for Floppy Disk Drives.
  • JSB Tech Pte Ltd is incorporated in Singapore, 2002, to replace the function of JM (S'Pore) Marketing and further extend into Research & Development activities.
  • Obtain ISO 14001, UL, TUV, CSA Certification.
  • Ventura Electronic (Suzhou) Co. Ltd was established. It ceased in 2010 to be replaced by our Sales Office, Li Huang (Shanghai) Co. Ltd.
  • Engaged in Highly Precision Mechanical Module Assembly (e.g. Optical Pick-up Head assembly for CD R/W and DVD R/W)
  • Pb-Free Process Standardization, Production Standing-Operation System and Cell Manufacturing Systems established at our affiliated factories.
  • Awarded Sony OEM Green Partnership


Expanded into Precision Plastic Injection Moulding to manufacture component for Floppy, CD and DVD Magnetic and Optical Computer Data Storage Drives.


Established our first manufactruing site.


Established the first company